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New Socket Solution Optimizes Production Testing of QFN-packaged ICs

Advances in semiconductor functionality, density, and chip-level integration are generating new challenges in testing. A test socket solution overcomes the challenges posed by traditional vertical spring probes and cantilever scrubbing contact designs, providing a new level of performance and reliability. Integrated circuit (IC) designers are increasingly migrating to quad flat no-lead (QFN) packages to meetRead More

eBook 2023 The Age of Connected Technology
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