Month: February 2014

TE’s CeeLok FAS-T Nano Circular Connector Delivers 10GB Ethernet in Lightweight Package

TE’s CeeLok FAS-T nano circular connector expands its high-speed, harsh environment offerings for military, commercial aerospace, and marine/offshore applications. TE’s CeeLok FAS-T nano circular connector, a nanominiature, rugged I/O connector capable of meeting 10 GB Ethernet performance, provides a proven, noise-cancelling contact configuration that minimizes crosstalk, making it ideal for a variety of markets andRead More

ERNI’s MicroSpeed for Fast Board-to-Board Connections

ERNI’s Microspeed high-speed connectors support 25+Gb/s up to 5-20mm. Current measurements and simulations prove that ERNI’s MicroSpeed family of high-speed connectors, with corresponding design criteria and layout (-2dB insertion loss, 5mm board-to-board spacing), can support data rates of more than 25Gb/s. This in turn allows extremely fast board-to-board connections with distances of 5-20mm to beRead More

Molex zCD Interconnect Solves Next-Gen Data Transmission Requirements

Compact-form-factor Molex zCD connector delivers data rates scalable up to 400Gb/s. Molex Incorporated has developed the compact zCD interconnect system to support next-generation applications in telecommunications, networking, and enterprise computing environments. The Molex zCD interconnect system will transmit 400Gb/s data rates (25 Gb/s over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection, andRead More

2026 World Connector Market Handbook 2025-2031F
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