|
Ask Dr. Bob
Now, what else do I want
to do?
By Max Peel, Senior
Fellow, Contech Research
In the prior articles
of this series, the test groups described were for the determination or
susceptibility of connectors to basic failure mechanisms:
Vibration/Shock—Fretting Corrosion
Humidity/Thermal
Cycling—Fretting Corrosion
Mixed Flowing
Gas—Corrosion Issues
Temperature
Life—Stress Relaxation
So what do we do with
the catch-all term, Group 5, supplementary tests? Dr. Bob outlined the
variety of tests that may be included within this group. Essentially,
any destructive tests of interest should be provided for. It can also
include application-specific test sequences as well. A popular series of
tests, as an example, deal with power applications. In this instance,
there are three key elements with which to be concerned:
-
Current
Rating
-
Current
Cycling
-
Hot
Swap
The current rating tests (described in EIA 364, Test Procedure 70) is
used to establish how much current can be applied continuously through
contacts without exceeding a specific T-Rise, or to determine the T-Rise
of the system. An alternate approach is to establish a current derating
curve, which establishes and satisfies this premise: The T-Rise, plus
operating ambient of the equipment, should not exceed the temperature
rating of the equipment. This will result in a “fluctuating”
characteristic. The cooler the equipment operation temperature, the more
current the contact may carry. The later approach has become a popular
concept with users.
A current cycling test is used to determine the susceptibility of a
connector to thermal runaway and is a time-dependent mechanism. This is
an electrical stress test where the test current of interest is applied
and shut off a number of times (500 to 1000 cycles).
“Hot Swap” testing is to assure that connectors can be mated/unmated
while the power is still being applied. UL has procedures in place to
evaluate this condition.
Another area of testing relates to terminations such as compliant pins
(including impact of plated through-hole integrity), SMT solder joint
evaluation, etc. In some instances, these tests can be added to the
beginning and/or at the end of one or all of the basic sequences that
have been discussed.
The above examples may require a series of tests, as opposed to a test
that is classified as destructive. Destructive tests are final, no other
testing can be applied to the product after a destructive test. Some
examples of this are:
Thus, Group 5 may
contain several individual tests that are destructive, or some unique
sequence which will address a specific application issue.
The past series of
articles have presented basic testing concepts and philosophy. Testing
should be viewed, not only as what a connector should do, but
also what it’s capable of doing. And above all, testing needs to
show that there aren’t any “hidden faults” that may cause field failures
over time in the final product. This is particularly true in today’s
global environment, which is creating new headaches for the design
engineer.
It should not be used
as “success” testing. Test sequences, in combination with severity
levels and environmental durations, have to be put in proper perspective
to assure proper field usage requirements can be met or data generated.
Testing should be
viewed as a useful diagnostic tool, one that builds confidence in the
design and that has clear objectives. Those who create success test
sequences (designed to pass) get full credit for a test’s successes—and
shortcomings. A meaningful test program has to be carefully and
thoughtfully designed and developed, just as carefully as the product
which is to be tested. Sample size and the number of variable
measurements have to have some degree of statistical validity. Severity
levels should be as close as possible to the final application.
Environmental durations should be long enough to satisfy expected
operational life (this is probably the most difficult one to establish).
Testing should be
part of the product development process. It takes a patient, thorough
team to develop a proper procedure. If one chooses “success” testing,
all I can say is “Good luck and may God be with you.”
Send your comments
and questions to
AskDrBob@connectorsupplier.com.
Max Peel is a
Senior Fellow at Contech Research, an independent test and research lab
located in Attleboro, Massachusetts, U.S.A. For more information, visit
www.contechresearch
|